Core Advantages

•Strong adhesion without delamination, suitable for long-term use in electronic housings: Specifically optimized adhesion formula for electronic housing substrates, forming stable chemical bonds with ABS, PC, PP, and other substrates. Room-temperature peel strength is 5~11 N/cm, with minimal adhesion degradation across a wide temperature range (-40°C to 110°C). Resistant to impact, vibration, and thermal cycling, effectively addressing common industry issues such as adhesive failure, edge lifting, and delamination in overmolded electronic housings. Ensures tight bonding between the overmolded layer and housing substrate, suitable for various scenarios in daily use and handling of electronic devices.

•Scratch and wear resistance, enhancing housing texture and durability: Incorporates specialized anti-scratch and wear-resistant additives for electronics. The surface has moderate hardness, is smooth and fine, resistant to scratches from sharp objects, and less prone to wear or fuzzing. Maintains a flat and aesthetically pleasing appearance even after prolonged use. Also features good stain resistance, resisting dust and fingerprints, and can be cleaned with routine wiping. Meets the demand for high-end, easy-to-maintain electronic housings, extending the lifespan of electronic device housings.

•Insulation and flame retardancy, safeguarding electronic device safety: Excellent electrical insulation properties, with insulation resistance ≥10¹² Ω, effectively isolating current and preventing leakage in electronic housings to ensure user safety. Customizable flame-retardant formulations are available, compliant with UL94 V0 flame retardancy standards, effectively slowing flame spread and reducing safety hazards from overheating or short circuits. Suitable for overmolding needs of various electrified electronic device housings.

•Eco-friendly and odorless, meeting electronic application requirements: Utilizes a fully eco-friendly formulation system, halogen-free, non-toxic, odorless, and free from harmful leaching. Strictly controls harmful components such as heavy metals, plasticizers, and VOCs. Complies with domestic and international authoritative environmental standards like RoHS 2.0, REACH, and FDA. No irritating odors, suitable for enclosed electronic devices and scenarios involving prolonged human contact. No health risks with long-term use, 100% recyclable, aligning with green electronics development principles.

•Easy processing, adaptable to diverse electronic housing designs: Excellent melt flowability and uniform plasticization. Overmolding can be achieved via secondary injection molding or overmolding injection molding without complex pretreatment of the electronic housing substrate. Smooth molding without material accumulation or flash, resulting in flat, smooth surfaces free of burrs or bubbles. Low shrinkage rate (≤1.1%) and precise dimensions, suitable for lightweight, refined, and irregularly shaped electronic housing designs. No post-molding grinding required; sprues can be recycled, reducing production costs and significantly improving efficiency.

•High adaptability, customizable for personalized needs: Flexibility to adjust hardness (Shore 35~80A), elasticity, color, and surface texture. Customizable finishes such as matte, glossy, or textured, and various colors including black, white, and colored options. Uniform coloring with good stability, resistant to fading and migration. Adapts to personalized design needs of different brands and styles of electronic housings. Compatible with various electronic housing substrates such as standard ABS, flame-retardant ABS, PC, and PP. Suitable for standalone overmolding or composite molding, catering to both high-end customization and large-scale production demands.